Ven Holalkere
Founder & CEO

Ven has over twenty years of technical and executive experience in electronic packaging and thermal management from silicon to data center. From 2000 to 2006, Ven established and managed a thermal research group for Intel Labs. His areas of expertise include electronic packaging, assembly and thermal management. His international experience includes Norway, England, Japan and India. Mr Holalkere holds ten US patents and has authored several publications in thermal management and server packaging. He was a keynote speaker at the UPTIME Institute 2003 data center conference in California, and was invited to speak in 2007 at Data Center Dynamics, a data center conference held in Singapore. Mr Holalkere’s many years of advanced research led to the hybrid cooling breakthrough at the heart of CoolClouds technology.

Dr. Yogendra Joshi
Founder & CTO

Dr. Joshi teaches mechanical engineering at George Tech, where he holds the John M. McKenney and Warren D. Shiver Distinguished Chair and researches multi-scale thermal management. He received his Bachelor of Technology in Mechanical Engineering from the Indian Institute of Technology at Kanpur, M.S. in Mechanical Engineering from the SUNY, Buffalo, and a Ph.D. from the University of Pennsylvania. He is author or co-author of over 250 technical publications, and an elected Fellow of the American Society of Mechanical Engineers. He has received multiple awards, including the Inventor Recognition Award from the Semiconductor Research Corporation, the ASME Electronic and Photonic Packaging Division Outstanding Contribution Award in Thermal Management, and the IBM Faculty Award.

Steve DeNies
VP Engineering

Mr. DeNies has 25 years of product development and management experience in high tech firms. He began his career developing mission-critical electronic countermeasures and defense systems, then joined a startup, Voice Technologies Group, to develop computer-integrated telephony products. Over nine years, he developed a team of 45 engineers supporting three product lines, and secured partnerships to expand into adjacent markets. These accomplishments led to the company’s acquisition in 2001 by Intel, where Mr. DeNies continued to serve as a Director and Principal Engineer. He later joined Sun Microsystems (now Oracle) to manage the design and delivery of communications systems to the major network carriers across the globe. He has twice been honored with product-of-the-year awards and holds 11 patents.

Dennis Patton
VP Business Development

Mr. Patton brings 35 years of technical and corporate management experience in technology firms that include both hardware and software start-ups. He has served in management at various levels; from Product Manager to Vice President. His areas of expertise include sales and marketing management in electronic packaging. At Amkor; a silicon packaging contract manufacturer, Dennis setup a local ECAD design center in Santa Clara grade my paper to assist ASIC manufacturers with their custom substrate designs. At Kulicke & Soffa; a semiconductor equipment manufacturing company, Dennis managed sales for two Divisions. Dennis’ international experience includes managing sales and marketing at Fujitsu; a large Japanese technology company and provided high density fine-line substrate designs for the emerging flip chip market.
Dennis graduated from Purdue University with a BSAE degree in Aeronautical & Astronautical Engineering.

Feroze Khan

After graduating with a master’s degree in mechanical engineering from Regional Institute of Technology, Calicut, India, Feroze went on to become an expert in evaluating thermal issues in Data Centers using computer simulation tools. He currently works on developing “optimal thermal design” mathematical models for electronics cooling.